In this talk, I will show the recent unique demonstration of metasurfaces for successful miniaturization and performance acceleration of optical components and devices such as metalens-integrated camera/endoscope, full space dynamic structured light imaging, smart labelling and more. Then, I will discuss the recent approach for effective and efficient design of metasurfaces, and three low-cost manufacturing methods: 1) nanoimprinting with high-refractive-index dielectric particle embedding resin (PER), 2) bandgap engineering of hydrogenated amorphous silicon (a-Si:H), and 3) atomic-layer coating on imprinted resin. a-Si, TiO₂, and ZrO₂ PERs are used for metasurfaces at infrared (940 nm), visible (532 nm), and ultraviolet (325 and 248 nm), respectively; measured efficiencies reach 47% (940 nm), 91% (532 nm), 72% (325 nm), and 49% (248 nm). PER metasurfaces with an inverse design provide 3D, full-color holography at visible. The bandgap of a-Si:H is engineered to suppress optical losses, realizing metasurface efficiencies of 42% (450 nm), 65% (532 nm), and 75% (635 nm). We deposit an atomic layer on resin for 12-inch metasurfaces, achieving measured efficiencies of 61% (450 nm), 78% (532 nm), and 65% (635 nm). Finally, the recent development of mass production and manufacturing of metausrfaces and nanophotonic structures, and future direction with a bigger vision will be discussed.